墨水直写3D打印热电材料与器件研究进展

Research progress on direct ink writing & extrusion-based 3D printing of thermoelectric materials and devices

  • 摘要: 热电技术作为一种实现热能与电能直接相互转换的固态能量转换技术,在废热回收和局部制冷等领域展现出巨大的应用潜力。然而,传统制造工艺的复杂性、高成本以及复杂结构成型难度,严重制约了热电器件的性能优化与大规模应用。近年来,以墨水直写/挤出式(direct ink writing/extrusion-based, DIW)3D打印为代表的增材制造技术,为热电材料的制备及器件的一体化、定制化设计开辟了全新路径。本综述聚焦于DIW 3D打印技术在热电材料领域的应用,阐述该技术的核心原理,系统梳理关键工艺参数及打印热电材料体系的性能表现,深入剖析通过材料组分工程、微观结构(如多孔、梯度、晶格结构)调控及几何构型设计优化热电性能的前沿策略。此外,本综述探讨了该领域面临的核心挑战,包括功能性墨水的流变性设计、打印后处理过程中的结构保真度与性能衰减、界面接触优化及各向异性等问题,并展望了机器学习协同设计、多材料/多功能集成、原位表征与工业化应用等未来发展方向。

     

    Abstract: Thermoelectric (TE) technology, a solid-state energy conversion technique enabling direct conversion between thermal and electrical energy, holds significant potential for applications such as waste heat recovery and localized cooling. However, the complexity, high cost, and limitations in fabricating intricate geometries associated with conventional manufacturing processes have severely constrained the performance optimization and large-scale application of TE devices. In recent years, additive manufacturing technologies, particularly direct ink writing (DIW) and extrusion-based 3D printing, have opened new avenues for preparing TE materials and designing integrated, customized devices. This review focuses on the application of DIW 3D printing in the field of TE materials. It introduces the core principles of the technology, systematically reviews key process parameters and the performance of printed TE material systems, and analyzes advanced strategies for optimizing TE performance through material composition engineering, microstructural tailoring (e.g., porous, gradient, and lattice structures), and geometric design. Furthermore, this review discusses key challenges in the field, including the rheological design of functional inks, structural fidelity and performance degradation during printing and post-processing, interface contact optimization, and anisotropy. Finally, future directions are envisioned, such as machine learning-assisted design, multi-material and multifunctional integration, in situ characterization, and industrial-scale applications.

     

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